Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

RS Stock No.: 752-4881Brand: BergquistManufacturers Part No.: HF650P-0.001-01-00-54
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Technical Document

Specifications

Brand

Bergquist

Thickness

0.001in

Thermal Conductivity

1.5W/m·K

Material

Hi-Flow 650P

Self-Adhesive

Yes

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+150°C

Material Trade Name

Hi-Flow 650P

Operating Temperature Range

-40 → +150 °C

Country of Origin

United States

Product details

Hi-Flow 650P

Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.

Thermal Impedance: 0.20°C-in2/W (@25 psi)
150°C high temperature reliability
Natural tack one side for ease of assembly
Exceptional thermal performance in an insulated pad

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EGP 96.35

Each (In a Bag of 50) (ex VAT)

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

50

Available in multiples of 50
50EGP 4,817.50
100EGP 9,635.00
150EGP 14,452.50
200EGP 19,270.00
250EGP 24,087.50
300EGP 28,905.00
350EGP 33,722.50
400EGP 38,540.00
450EGP 43,357.50
500EGP 48,175.00
550EGP 52,992.50
600EGP 57,810.00
650EGP 62,627.50
700EGP 67,445.00
750EGP 72,262.50

EGP 96.35

Each (In a Bag of 50) (ex VAT)

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Stock information temporarily unavailable.

50

Available in multiples of 50
50EGP 4,817.50
100EGP 9,635.00
150EGP 14,452.50
200EGP 19,270.00
250EGP 24,087.50
300EGP 28,905.00
350EGP 33,722.50
400EGP 38,540.00
450EGP 43,357.50
500EGP 48,175.00
550EGP 52,992.50
600EGP 57,810.00
650EGP 62,627.50
700EGP 67,445.00
750EGP 72,262.50
You may be interested in

Technical Document

Specifications

Brand

Bergquist

Thickness

0.001in

Thermal Conductivity

1.5W/m·K

Material

Hi-Flow 650P

Self-Adhesive

Yes

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+150°C

Material Trade Name

Hi-Flow 650P

Operating Temperature Range

-40 → +150 °C

Country of Origin

United States

Product details

Hi-Flow 650P

Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.

Thermal Impedance: 0.20°C-in2/W (@25 psi)
150°C high temperature reliability
Natural tack one side for ease of assembly
Exceptional thermal performance in an insulated pad

You may be interested in