Technical Document
Specifications
Brand
WinbondMemory Size
8Gbit
Interface Type
Parallel
Package Type
TSOP
Pin Count
48
Organisation
1024K x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
12.1mm
Height
1.05mm
Width
18.5mm
Dimensions
18.5 x 12.1 x 1.05mm
Series
W29N
Number of Words
1024K
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
25µs
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P.O.A.
96
P.O.A.
96
Technical Document
Specifications
Brand
WinbondMemory Size
8Gbit
Interface Type
Parallel
Package Type
TSOP
Pin Count
48
Organisation
1024K x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
12.1mm
Height
1.05mm
Width
18.5mm
Dimensions
18.5 x 12.1 x 1.05mm
Series
W29N
Number of Words
1024K
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
25µs