Vishay 4.7μF Surface Mount Polymer Capacitor, 10V dc

RS Stock No.: 173-3690Brand: VishayManufacturers Part No.: T55P475M010C0200
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Technical Document

Specifications

Brand

Vishay

Technology

Polymer

Capacitance

4.7µF

Voltage

10V dc

Dielectric Material Family

Tantalum

Mounting Type

Surface Mount

Package/Case

2012-12

Equivalent Series Resistance

200mΩ

Tolerance

±20%

Length

2mm

Depth

1.25mm

Maximum Operating Temperature

+105°C

Height

1.2mm

Dimensions

2 x 1.25 x 1.2mm

Series

T55

Electrolyte Type

Solid

Minimum Operating Temperature

-55°C

Leakage Current

10 μA

Product details

T55 Series

T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type

Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets

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EGP 34.93

Each (On a Reel of 3000) (ex VAT)

Vishay 4.7μF Surface Mount Polymer Capacitor, 10V dc

EGP 34.93

Each (On a Reel of 3000) (ex VAT)

Vishay 4.7μF Surface Mount Polymer Capacitor, 10V dc
Stock information temporarily unavailable.

Ideate. Create. Collaborate

JOIN FOR FREE

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  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
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Technical Document

Specifications

Brand

Vishay

Technology

Polymer

Capacitance

4.7µF

Voltage

10V dc

Dielectric Material Family

Tantalum

Mounting Type

Surface Mount

Package/Case

2012-12

Equivalent Series Resistance

200mΩ

Tolerance

±20%

Length

2mm

Depth

1.25mm

Maximum Operating Temperature

+105°C

Height

1.2mm

Dimensions

2 x 1.25 x 1.2mm

Series

T55

Electrolyte Type

Solid

Minimum Operating Temperature

-55°C

Leakage Current

10 μA

Product details

T55 Series

T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type

Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more