Vishay 22μF Surface Mount Polymer Capacitor, 6.3V dc

RS Stock No.: 173-1345Brand: VishayManufacturers Part No.: T55A226M6R3C0200
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Technical Document

Specifications

Brand

Vishay

Technology

Polymer

Capacitance

22µF

Voltage

6.3V dc

Dielectric Material Family

Tantalum

Mounting Type

Surface Mount

Package/Case

3216-18

Equivalent Series Resistance

200mΩ

Tolerance

±20%

Length

3.2mm

Depth

1.6mm

Maximum Operating Temperature

+105°C

Height

1.6mm

Dimensions

3.2 x 1.6 x 1.6mm

Series

T55

Electrolyte Type

Solid

Leakage Current

13.8 μA

Minimum Operating Temperature

-55°C

Product details

T55 Series

T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type

Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets

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EGP 21.82

Each (On a Reel of 2000) (ex VAT)

Vishay 22μF Surface Mount Polymer Capacitor, 6.3V dc

EGP 21.82

Each (On a Reel of 2000) (ex VAT)

Vishay 22μF Surface Mount Polymer Capacitor, 6.3V dc
Stock information temporarily unavailable.

Technical Document

Specifications

Brand

Vishay

Technology

Polymer

Capacitance

22µF

Voltage

6.3V dc

Dielectric Material Family

Tantalum

Mounting Type

Surface Mount

Package/Case

3216-18

Equivalent Series Resistance

200mΩ

Tolerance

±20%

Length

3.2mm

Depth

1.6mm

Maximum Operating Temperature

+105°C

Height

1.6mm

Dimensions

3.2 x 1.6 x 1.6mm

Series

T55

Electrolyte Type

Solid

Leakage Current

13.8 μA

Minimum Operating Temperature

-55°C

Product details

T55 Series

T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type

Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets