Technical Document
Specifications
Brand
TDKInductance
3.3 μH
Maximum dc Current
2A
Package/Case
4012
Length
4mm
Depth
4mm
Height
1.2mm
Dimensions
4 x 4 x 1.2mm
Shielded
Yes
Tolerance
±20%
Maximum DC Resistance
102mΩ
Series
VLS-E
Core Material
Ferrite
Maximum Self Resonant Frequency
1MHz
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+105°C
Minimum Operating Temperature
-40°C
Product details
VLS-E series Shielded Magnetic Power Choke
Professional range of TDK magnetic shield wound inductor for power circuits from the VLS-E series and compatible with high density mounting.
Features and Benefits:
The VLS-E series have a low profile product lineup with max. heights of 0.8 mm, 0.95 mm, 1.0 mm, 1.2 mm, and 1.5 mm allowing for various applications
High magnetic shield construction and compatible with high density mounting
Applications:
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices and compact power supply modules
TDK Non Standard SMT Inductors (Chokes)
Stock information temporarily unavailable.
Please check again later.
EGP 14.31
Each (Supplied on a Reel) (ex VAT)
Production pack (Reel)
5
EGP 14.31
Each (Supplied on a Reel) (ex VAT)
Production pack (Reel)
5
Technical Document
Specifications
Brand
TDKInductance
3.3 μH
Maximum dc Current
2A
Package/Case
4012
Length
4mm
Depth
4mm
Height
1.2mm
Dimensions
4 x 4 x 1.2mm
Shielded
Yes
Tolerance
±20%
Maximum DC Resistance
102mΩ
Series
VLS-E
Core Material
Ferrite
Maximum Self Resonant Frequency
1MHz
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+105°C
Minimum Operating Temperature
-40°C
Product details
VLS-E series Shielded Magnetic Power Choke
Professional range of TDK magnetic shield wound inductor for power circuits from the VLS-E series and compatible with high density mounting.
Features and Benefits:
The VLS-E series have a low profile product lineup with max. heights of 0.8 mm, 0.95 mm, 1.0 mm, 1.2 mm, and 1.5 mm allowing for various applications
High magnetic shield construction and compatible with high density mounting
Applications:
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices and compact power supply modules