RS PRO Heatsink, Universal Rectangular Alu, 1.9°C/W 25 mm 75 mm 88 mm

RS Stock No.: 789-8558Brand: RS PRODistrelec Article No.: 30403512
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Technical Document

Specifications

Brand

RS Pro

Product Type

Heatsink

For Use With

Universal Rectangular Alu

Length

75mm

Width

88 mm

Height

25mm

Thermal Resistance

1.9°C/W

Colour

Black

Finish

Black Anodised

Standards/Approvals

RoHS

Material

Aluminium

Country of Origin

United Kingdom

Product details

Low Profile Non-standard Extrusion With Channel

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

View all in Heatsinks

Stock information temporarily unavailable.

EGP 1,090.02

EGP 1,090.02 Each (ex VAT)

RS PRO Heatsink, Universal Rectangular Alu, 1.9°C/W 25 mm 75 mm 88 mm

1

Available in multiples of 1
1EGP 1,090.02
2EGP 2,180.04
3EGP 3,270.06
4EGP 4,360.08
5EGP 5,450.10
6EGP 6,540.12
7EGP 7,630.14
8EGP 8,720.16
9EGP 9,810.18
10EGP 10,900.20
11EGP 11,990.22
12EGP 13,080.24
13EGP 14,170.26
14EGP 15,260.28
15EGP 16,350.30

EGP 1,090.02

EGP 1,090.02 Each (ex VAT)

RS PRO Heatsink, Universal Rectangular Alu, 1.9°C/W 25 mm 75 mm 88 mm

Stock information temporarily unavailable.

1

Available in multiples of 1
1EGP 1,090.02
2EGP 2,180.04
3EGP 3,270.06
4EGP 4,360.08
5EGP 5,450.10
6EGP 6,540.12
7EGP 7,630.14
8EGP 8,720.16
9EGP 9,810.18
10EGP 10,900.20
11EGP 11,990.22
12EGP 13,080.24
13EGP 14,170.26
14EGP 15,260.28
15EGP 16,350.30

Technical Document

Specifications

Brand

RS Pro

Product Type

Heatsink

For Use With

Universal Rectangular Alu

Length

75mm

Width

88 mm

Height

25mm

Thermal Resistance

1.9°C/W

Colour

Black

Finish

Black Anodised

Standards/Approvals

RoHS

Material

Aluminium

Country of Origin

United Kingdom

Product details

Low Profile Non-standard Extrusion With Channel

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.