Technical Document
Specifications
Brand
MolexGender
Female
Product Type
Crimp Terminal
For Use With
Micro-Latch and Mi II Connector Housings
Current
2A
Series
50212
Contact Plating
Tin
Minimum Wire Size mm²
0.05mm²
Minimum Wire Size AWG
30AWG
Contact Material
Phosphor Bronze
Maximum Wire Size mm²
0.2mm²
Maximum Wire Size AWG
24AWG
Maximum Contact Resistance
20mΩ
Minimum Operating Temperature
-40°C
Termination Type
Crimp
Maximum Operating Temperature
105°C
Standards/Approvals
No
Product details
Crimp Terminal, 50212 Series
A range of Molex Series 50212 Crimp Terminal contacts for use with 51065 Series housings typical stock number 688-2603 . Use Crimp tool number 710-6559.
2.0mm Wire to Board Molex Micro-Latch
This system applies a friction lock mechanism where the noses on receptacle housings slide into the header wall openings. This ensures a durable mating and a protection of the electrical circuitry.
Stock information temporarily unavailable.
EGP 144,000.00
EGP 3.00 Each (On a Reel of 48000) (ex VAT)
48000
EGP 144,000.00
EGP 3.00 Each (On a Reel of 48000) (ex VAT)
Stock information temporarily unavailable.
48000
Technical Document
Specifications
Brand
MolexGender
Female
Product Type
Crimp Terminal
For Use With
Micro-Latch and Mi II Connector Housings
Current
2A
Series
50212
Contact Plating
Tin
Minimum Wire Size mm²
0.05mm²
Minimum Wire Size AWG
30AWG
Contact Material
Phosphor Bronze
Maximum Wire Size mm²
0.2mm²
Maximum Wire Size AWG
24AWG
Maximum Contact Resistance
20mΩ
Minimum Operating Temperature
-40°C
Termination Type
Crimp
Maximum Operating Temperature
105°C
Standards/Approvals
No
Product details
Crimp Terminal, 50212 Series
A range of Molex Series 50212 Crimp Terminal contacts for use with 51065 Series housings typical stock number 688-2603 . Use Crimp tool number 710-6559.
2.0mm Wire to Board Molex Micro-Latch
This system applies a friction lock mechanism where the noses on receptacle housings slide into the header wall openings. This ensures a durable mating and a protection of the electrical circuitry.


