Technical Document
Specifications
Brand
JSTSeries
PA
Pitch
2.0mm
Number Of Contacts
8
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Copper Alloy
Current Rating
3.0A
Voltage Rating
250.0 V
Country of Origin
Malaysia
Product details
Side Entry Headers
For suitable housings see stock number 476-6760 typical
2.0 mm JST PA Range
The PA interconnection system on a 2.0mm pitch provides a secure wire to board connection with additional locking device feature. The thumb depress mechanism prevents accidental disconnection during assembly or as a result of vibration. Suitable for a wide range of applications where a secure anti-vibration connection is required.
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EGP 502.40
EGP 50.24 Each (In a Pack of 10) (ex VAT)
Standard
10
EGP 502.40
EGP 50.24 Each (In a Pack of 10) (ex VAT)
Standard
10
Technical Document
Specifications
Brand
JSTSeries
PA
Pitch
2.0mm
Number Of Contacts
8
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Copper Alloy
Current Rating
3.0A
Voltage Rating
250.0 V
Country of Origin
Malaysia
Product details
Side Entry Headers
For suitable housings see stock number 476-6760 typical
2.0 mm JST PA Range
The PA interconnection system on a 2.0mm pitch provides a secure wire to board connection with additional locking device feature. The thumb depress mechanism prevents accidental disconnection during assembly or as a result of vibration. Suitable for a wide range of applications where a secure anti-vibration connection is required.