HARWIN 3.5mm Grounding Contact
Technical Document
Specifications
Brand
HARWINSeries
EZ-BoardWare
Material
Titanium Copper Alloy
Current Rating
4A
Fixing Method
Surface Mount
Contact Plating
Tin over Nickel
Dimensions
4.5 x 2.5 x 3.5mm
Height
3.5mm
Length
4.5mm
Width
2.5mm
Country of Origin
China
Product details
Harwin EZ Boardware SMT RFI/Grounding Spring Contacts
EZ-BoardWare SMT grounding/RFI spring contacts for use on surface mount PCBs that are in contact with metal shields or frames. The simple C style design of these EZ-BoardWare spring contacts provides excellent spring properties and ensures positive contact with the mating surface. These EZ-BoardWare RFI/grounding contacts are suitable for both wiping and sliding actions and are ideal for automated requirements using standard placement equipment. Stock numbers 788-4852 and 788-4858 are multi-directional spring contacts that have a unique spring feature that works in both the vertical and horizontal orientations. This feature makes them ideal for use in PCB edge connections to a chassis.
Features and Benefits
Ideal for use on surface mount PCBs
Excellent spring properties
Designed for automated application using standard placement equipment
Suitable for wiping and sliding applications
Multidirection versions for PCB edge connections
Available in a wide range working heights
Applications
The compact size of these EZ-BoardWare grounding spring contacts makes them ideal for use in areas where there is limited access and in Blindmate applications. Typical applications include POS tracking, home entertainment and instrument panels, Industrial process control equipment, Mobile power units, Motion control units
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EGP 20.86
Each (On a Reel of 2000) (ex VAT)
2000
EGP 20.86
Each (On a Reel of 2000) (ex VAT)
2000
Technical Document
Specifications
Brand
HARWINSeries
EZ-BoardWare
Material
Titanium Copper Alloy
Current Rating
4A
Fixing Method
Surface Mount
Contact Plating
Tin over Nickel
Dimensions
4.5 x 2.5 x 3.5mm
Height
3.5mm
Length
4.5mm
Width
2.5mm
Country of Origin
China
Product details
Harwin EZ Boardware SMT RFI/Grounding Spring Contacts
EZ-BoardWare SMT grounding/RFI spring contacts for use on surface mount PCBs that are in contact with metal shields or frames. The simple C style design of these EZ-BoardWare spring contacts provides excellent spring properties and ensures positive contact with the mating surface. These EZ-BoardWare RFI/grounding contacts are suitable for both wiping and sliding actions and are ideal for automated requirements using standard placement equipment. Stock numbers 788-4852 and 788-4858 are multi-directional spring contacts that have a unique spring feature that works in both the vertical and horizontal orientations. This feature makes them ideal for use in PCB edge connections to a chassis.
Features and Benefits
Ideal for use on surface mount PCBs
Excellent spring properties
Designed for automated application using standard placement equipment
Suitable for wiping and sliding applications
Multidirection versions for PCB edge connections
Available in a wide range working heights
Applications
The compact size of these EZ-BoardWare grounding spring contacts makes them ideal for use in areas where there is limited access and in Blindmate applications. Typical applications include POS tracking, home entertainment and instrument panels, Industrial process control equipment, Mobile power units, Motion control units