Bourns, 4300R 100kΩ ±2% Bussed Resistor Array, 8 Resistors, 1.13W total, SIP, Through Hole

RS Stock No.: 161-7165Brand: BournsManufacturers Part No.: 4309R-101-104LF
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Technical Document

Specifications

Brand

Bourns

Resistance

100kΩ

Number Of Resistors

8

Resistor Type

Network

Package/Case

SIP

Power Rating

1.13W

Termination Style

Through Hole

Tolerance

±2%

Case Style

Moulded

Power Rating per Resistor

0.2W

Circuit Designator

BUS

Length

22.45mm

Depth

2.16mm

Height

4.95mm

Dimensions

22.45 x 2.16 x 4.95mm

Number of Terminals

9

Series

4300R

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Temperature Coefficient

±100ppm/°C

Country of Origin

Costa Rica

Product details

Thick Film Molded SIPs - 4300R Series

Bourns® 4300R Series thick film molded SIPs compatible with automatic insertion equipment .

Low profile provides compatibility with DIPs
Superior package integrity
Marking on contrasting background for permanent identification

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Please check again later.

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EGP 193.70

Each (In a Tube of 22) (ex VAT)

Bourns, 4300R 100kΩ ±2% Bussed Resistor Array, 8 Resistors, 1.13W total, SIP, Through Hole

EGP 193.70

Each (In a Tube of 22) (ex VAT)

Bourns, 4300R 100kΩ ±2% Bussed Resistor Array, 8 Resistors, 1.13W total, SIP, Through Hole
Stock information temporarily unavailable.

Technical Document

Specifications

Brand

Bourns

Resistance

100kΩ

Number Of Resistors

8

Resistor Type

Network

Package/Case

SIP

Power Rating

1.13W

Termination Style

Through Hole

Tolerance

±2%

Case Style

Moulded

Power Rating per Resistor

0.2W

Circuit Designator

BUS

Length

22.45mm

Depth

2.16mm

Height

4.95mm

Dimensions

22.45 x 2.16 x 4.95mm

Number of Terminals

9

Series

4300R

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Temperature Coefficient

±100ppm/°C

Country of Origin

Costa Rica

Product details

Thick Film Molded SIPs - 4300R Series

Bourns® 4300R Series thick film molded SIPs compatible with automatic insertion equipment .

Low profile provides compatibility with DIPs
Superior package integrity
Marking on contrasting background for permanent identification