Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

RS Stock No.: 127-041Brand: BergquistManufacturers Part No.: HF225FAC-0.004-AC-1112
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Technical Document

Specifications

Brand

Bergquist

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Country of Origin

United States

Product details

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm

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Stock information temporarily unavailable.

EGP 6,083.65

Each (ex VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

1

Available in multiples of 1
1EGP 6,083.65
2EGP 12,167.30
3EGP 18,250.95
4EGP 24,334.60
5EGP 30,418.25
6EGP 36,501.90
7EGP 42,585.55
8EGP 48,669.20
9EGP 54,752.85
10EGP 60,836.50
11EGP 66,920.15
12EGP 73,003.80
13EGP 79,087.45
14EGP 85,171.10
15EGP 91,254.75

EGP 6,083.65

Each (ex VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in
Stock information temporarily unavailable.

1

Available in multiples of 1
1EGP 6,083.65
2EGP 12,167.30
3EGP 18,250.95
4EGP 24,334.60
5EGP 30,418.25
6EGP 36,501.90
7EGP 42,585.55
8EGP 48,669.20
9EGP 54,752.85
10EGP 60,836.50
11EGP 66,920.15
12EGP 73,003.80
13EGP 79,087.45
14EGP 85,171.10
15EGP 91,254.75

Technical Document

Specifications

Brand

Bergquist

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Country of Origin

United States

Product details

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm