The Dexter Corporation 12mm
Technical Document
Specifications
Product details
Polyamide Hot Melt Glue
Excellent gap filling performance
Low temperature flexibility
Shock and heat resistance
Easy to apply and fast fixing
UL94V-0 Rating
Low Viscosity: Typical uses - wire staking, cable terminal encapsulation.
Hot melt polyamide adhesives, creamy-brown, for advanced electronic potting and assembly. Glue is applied in the Polyamide Glue Gun.
Low temperature flexibility and excellent impact resistance
Ideal where substrates may be exposed to temperature extremes
Elastomeric (elongation 900%)
Can also be used to bond PC board
Tough, flexible adhesive with excellent adhesion
Tensile strength, 600PSI
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EGP 3,710.67
Each (ex VAT)
1
EGP 3,710.67
Each (ex VAT)
1
Technical Document
Specifications
Product details
Polyamide Hot Melt Glue
Excellent gap filling performance
Low temperature flexibility
Shock and heat resistance
Easy to apply and fast fixing
UL94V-0 Rating
Low Viscosity: Typical uses - wire staking, cable terminal encapsulation.
Hot melt polyamide adhesives, creamy-brown, for advanced electronic potting and assembly. Glue is applied in the Polyamide Glue Gun.
Low temperature flexibility and excellent impact resistance
Ideal where substrates may be exposed to temperature extremes
Elastomeric (elongation 900%)
Can also be used to bond PC board
Tough, flexible adhesive with excellent adhesion
Tensile strength, 600PSI