RS PRO Heatsink, Universal Rectangular Alu, 0.5°C/W, 250 x 125 x 50mm

RS Stock No.: 789-8570Brand: RS PRO
brand-logo
View all in Heatsinks

Technical Document

Specifications

Brand

RS Pro

For Use With

Universal Rectangular Alu

Length

250mm

Width

125mm

Height

50mm

Dimensions

250 x 125 x 50mm

Thermal Resistance

0.5°C/W

Colour

Black

Material

Aluminium

Country of Origin

United Kingdom

Product details

Flatback 125mm Wide x 50mm High With Channel

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

Stock information temporarily unavailable.

Please check again later.

Stock information temporarily unavailable.

EGP 6,719.54

EGP 6,719.54 Each (ex VAT)

RS PRO Heatsink, Universal Rectangular Alu, 0.5°C/W, 250 x 125 x 50mm

1

Available in multiples of 1
1EGP 6,719.54
2EGP 13,439.08
3EGP 20,158.62
4EGP 26,878.16
5EGP 33,597.70
6EGP 40,317.24
7EGP 47,036.78
8EGP 53,756.32
9EGP 60,475.86
10EGP 67,195.40
11EGP 73,914.94
12EGP 80,634.48
13EGP 87,354.02
14EGP 94,073.56
15EGP 100,793.10

EGP 6,719.54

EGP 6,719.54 Each (ex VAT)

RS PRO Heatsink, Universal Rectangular Alu, 0.5°C/W, 250 x 125 x 50mm
Stock information temporarily unavailable.

1

Available in multiples of 1
1EGP 6,719.54
2EGP 13,439.08
3EGP 20,158.62
4EGP 26,878.16
5EGP 33,597.70
6EGP 40,317.24
7EGP 47,036.78
8EGP 53,756.32
9EGP 60,475.86
10EGP 67,195.40
11EGP 73,914.94
12EGP 80,634.48
13EGP 87,354.02
14EGP 94,073.56
15EGP 100,793.10

Technical Document

Specifications

Brand

RS Pro

For Use With

Universal Rectangular Alu

Length

250mm

Width

125mm

Height

50mm

Dimensions

250 x 125 x 50mm

Thermal Resistance

0.5°C/W

Colour

Black

Material

Aluminium

Country of Origin

United Kingdom

Product details

Flatback 125mm Wide x 50mm High With Channel

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.