Technical Document
Specifications
Number of Elements per Chip
1
Propagation Delay Test Condition
30pF
Pin Count
5
Logic Function
Buffer
Minimum Operating Temperature
-40 °C
Maximum Low Level Output Current
2.6mA
Maximum Operating Temperature
+85 °C
Mounting Type
Surface Mount
Maximum High Level Output Current
-2.6mA
Logic Family
FXLP
Minimum Operating Supply Voltage
1 V
Maximum Operating Supply Voltage
3.6 V
Package Type
SC-70
Maximum Propagation Delay Time @ Maximum CL
48.6 ns @ 1 V
Batteries
3 x AAA BatteryDimensions
2 x 1.25 x 1mm
Product details
TC7MBD / SBD Series, Toshiba
For level translation from 5 V system to 3.3 V system
Power supply voltage: 4.5 to 5.5 V
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EGP 39.33
Each (On a Reel of 3000) (ex VAT)
3000
EGP 39.33
Each (On a Reel of 3000) (ex VAT)
3000
Technical Document
Specifications
Number of Elements per Chip
1
Propagation Delay Test Condition
30pF
Pin Count
5
Logic Function
Buffer
Minimum Operating Temperature
-40 °C
Maximum Low Level Output Current
2.6mA
Maximum Operating Temperature
+85 °C
Mounting Type
Surface Mount
Maximum High Level Output Current
-2.6mA
Logic Family
FXLP
Minimum Operating Supply Voltage
1 V
Maximum Operating Supply Voltage
3.6 V
Package Type
SC-70
Maximum Propagation Delay Time @ Maximum CL
48.6 ns @ 1 V
Batteries
3 x AAA BatteryDimensions
2 x 1.25 x 1mm
Product details
TC7MBD / SBD Series, Toshiba
For level translation from 5 V system to 3.3 V system
Power supply voltage: 4.5 to 5.5 V