200Ω RS PRO Surface Mount Chip Balun
Technical Document
Specifications
Brand
RS ProUnbalance Impedance
50Ω
Balance Impedance
200Ω
Mounting Type
Surface Mount
Pin Count
10
Dimensions
2 x 1.25 x 0.95mm
Height
0.95mm
Length
2mm
Width_SC_PC
1.25mm
Maximum Operating Temperature
+85°C
Minimum Operating Temperature
-40°C
Country of Origin
Taiwan, Province Of China
Product details
RS Multilayer Chip Baluns, RFBLN Series, 2012 (0805)
RS Pro range offers RFBLN Series, 2012 (0805) Multilayer Chip Baluns with a
miniature footprint: 2.0 x 1.2 x 0.9 mm³.
2 different working band devices Integrated into one package; GSM 850/ GSM 900/ DCS1800/ PCS1900 / TD SCDMA Bands B34 Band Working Frequency
Features and Benefits
Low Insertion Loss
Low in band Amplitude and Phase imbalance enable high performance wireless system operation
Low Temperature Co-fired Ceramic components
Second harmonic suppression
ISM band suppression
Applications:
GSM 850/ GSM 900/ DCS1800/ PCS1900 /TD2025 Band RF and Unbalance to balance conversion
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P.O.A.
20
P.O.A.
20
Technical Document
Specifications
Brand
RS ProUnbalance Impedance
50Ω
Balance Impedance
200Ω
Mounting Type
Surface Mount
Pin Count
10
Dimensions
2 x 1.25 x 0.95mm
Height
0.95mm
Length
2mm
Width_SC_PC
1.25mm
Maximum Operating Temperature
+85°C
Minimum Operating Temperature
-40°C
Country of Origin
Taiwan, Province Of China
Product details
RS Multilayer Chip Baluns, RFBLN Series, 2012 (0805)
RS Pro range offers RFBLN Series, 2012 (0805) Multilayer Chip Baluns with a
miniature footprint: 2.0 x 1.2 x 0.9 mm³.
2 different working band devices Integrated into one package; GSM 850/ GSM 900/ DCS1800/ PCS1900 / TD SCDMA Bands B34 Band Working Frequency
Features and Benefits
Low Insertion Loss
Low in band Amplitude and Phase imbalance enable high performance wireless system operation
Low Temperature Co-fired Ceramic components
Second harmonic suppression
ISM band suppression
Applications:
GSM 850/ GSM 900/ DCS1800/ PCS1900 /TD2025 Band RF and Unbalance to balance conversion