Technical Document
Specifications
Brand
onsemiLogic Family
ACT
Mounting Type
Surface Mount
Number of Elements per Chip
2
Package Type
TSSOP
Pin Count
20
Output Type
3 State
Logic Function
Buffer
Dimensions
6.6 x 4.5 x 1.05mm
Maximum Low Level Output Current
24mA
Maximum High Level Output Current
-24mA
Propagation Delay Test Condition
50pF
Maximum Propagation Delay Time @ Maximum CL
10 ns @ 50 pF
Maximum Operating Supply Voltage
2 to 6 V
Maximum Operating Temperature
+85 °C
Minimum Operating Supply Voltage
2 V
Minimum Operating Temperature
-40 °C
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P.O.A.
Production pack (Reel)
25
P.O.A.
Production pack (Reel)
25
Technical Document
Specifications
Brand
onsemiLogic Family
ACT
Mounting Type
Surface Mount
Number of Elements per Chip
2
Package Type
TSSOP
Pin Count
20
Output Type
3 State
Logic Function
Buffer
Dimensions
6.6 x 4.5 x 1.05mm
Maximum Low Level Output Current
24mA
Maximum High Level Output Current
-24mA
Propagation Delay Test Condition
50pF
Maximum Propagation Delay Time @ Maximum CL
10 ns @ 50 pF
Maximum Operating Supply Voltage
2 to 6 V
Maximum Operating Temperature
+85 °C
Minimum Operating Supply Voltage
2 V
Minimum Operating Temperature
-40 °C