Technical Document
Specifications
Brand
MolexCard Type
Mini SIM Card
Insertion/Removal Method
Push/Pull
Gender
Female
Number Of Contacts
8
Number Of Rows
1
Pitch
2.54mm
Mounting Type
Surface Mount
Contact Material
Copper Alloy
Contact Plating
Gold over Nickel
Termination Method
Solder
Housing Material
Steel, Thermoplastic
Length
21.0mm
Width
1.5mm
Depth
28.0mm
Dimensions
21 x 1.5 x 28mm
Minimum Operating Temperature
-20°C
Maximum Operating Temperature
+85°C
Series Number
78526
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Technical Document
Specifications
Brand
MolexCard Type
Mini SIM Card
Insertion/Removal Method
Push/Pull
Gender
Female
Number Of Contacts
8
Number Of Rows
1
Pitch
2.54mm
Mounting Type
Surface Mount
Contact Material
Copper Alloy
Contact Plating
Gold over Nickel
Termination Method
Solder
Housing Material
Steel, Thermoplastic
Length
21.0mm
Width
1.5mm
Depth
28.0mm
Dimensions
21 x 1.5 x 28mm
Minimum Operating Temperature
-20°C
Maximum Operating Temperature
+85°C
Series Number
78526