Heatsink, D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors, 15°C/W, 25.91 x 14.99 x 9.52mm,

RS Stock No.: 880-6008Brand: AAVID THERMALLOYManufacturers Part No.: 7106DG
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Technical Document

Specifications

Brand

AAVID THERMALLOY

For Use With

D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors

Length

25.91mm

Width

14.99mm

Height

9.52mm

Dimensions

25.91 x 14.99 x 9.52mm

Thermal Resistance

15°C/W

Mounting

Horizontal

Series

7106

Package Type

SMT

Material

Aluminium

Application

Through Hole Discrete Semiconductors

Finish

Tin Plated

Special Features

The Device and the Heat Sink are Soldered Directly to a Modified Drain Pad Creating a Thermal Transfer Path from Package Tab to the Heat Sink

Country of Origin

China

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EGP 28.61

Each (In a Pack of 50) (ex VAT)

Heatsink, D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors, 15°C/W, 25.91 x 14.99 x 9.52mm,

50

Available in multiples of 50
50EGP 1,430.50
100EGP 2,861.00
150EGP 4,291.50
200EGP 5,722.00
250EGP 7,152.50
300EGP 8,583.00
350EGP 10,013.50
400EGP 11,444.00
450EGP 12,874.50
500EGP 14,305.00
550EGP 15,735.50
600EGP 17,166.00
650EGP 18,596.50
700EGP 20,027.00
750EGP 21,457.50

EGP 28.61

Each (In a Pack of 50) (ex VAT)

Heatsink, D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors, 15°C/W, 25.91 x 14.99 x 9.52mm,
Stock information temporarily unavailable.

50

Available in multiples of 50
50EGP 1,430.50
100EGP 2,861.00
150EGP 4,291.50
200EGP 5,722.00
250EGP 7,152.50
300EGP 8,583.00
350EGP 10,013.50
400EGP 11,444.00
450EGP 12,874.50
500EGP 14,305.00
550EGP 15,735.50
600EGP 17,166.00
650EGP 18,596.50
700EGP 20,027.00
750EGP 21,457.50

Technical Document

Specifications

Brand

AAVID THERMALLOY

For Use With

D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors

Length

25.91mm

Width

14.99mm

Height

9.52mm

Dimensions

25.91 x 14.99 x 9.52mm

Thermal Resistance

15°C/W

Mounting

Horizontal

Series

7106

Package Type

SMT

Material

Aluminium

Application

Through Hole Discrete Semiconductors

Finish

Tin Plated

Special Features

The Device and the Heat Sink are Soldered Directly to a Modified Drain Pad Creating a Thermal Transfer Path from Package Tab to the Heat Sink

Country of Origin

China